Qualcomm Unveils Power-Saving Wi-Fi Solution and AI-Ready IoT Platforms – News9 LIVE

At Embedded World 2024, Qualcomm Technologies unveiled its latest innovations, including a micro-power Wi-Fi SoC and AI-ready IoT platforms, set to transform the embedded and IoT ecosystem. With over 35 companies showcasing solutions powered by Qualcomm, the company solidifies its position in digital transformation across industries.

Qualcomm Launches Advanced Wi-Fi and AI IoT Platforms at Embedded World 2024

Qualcomm Technologies, showcased its advancements in Wi-Fi technology and artificial intelligence-ready platforms for the Internet of Things (IoT) and industrial applications at Embedded World 2024. This reveal marks a significant step in Qualcomm’s journey, positioning it as a pivotal player in the digital transformation across various industries.

Breakthrough in Wi-Fi and AI Platforms

At the forefront of Qualcomm’s announcements is the introduction of the Qualcomm® QCC730, a Wi-Fi solution that promises up to 88% lower power consumption than its predecessors. This innovation is designed to revolutionize IoT connectivity, particularly in battery-powered industrial, commercial, and consumer applications. The QCC730 is set to be complemented with an open-source Integrated Development Environment (IDE) and Software Development Kit (SDK), making cloud connectivity more accessible for developers.

Furthermore, Qualcomm unveiled the Qualcomm® RB3 Gen 2 Platform, a comprehensive hardware and software solution tailored for IoT and embedded applications. Leveraging the Qualcomm® QCS6490 processor, the RB3 Gen 2 Platform is expected to enhance on-device AI processing by tenfold, supporting multiple high-definition camera sensors, computer vision, and integrated Wi-Fi 6E. This platform is designed for a wide array of products, including robots, drones, and intelligent displays, and is now available for pre-order.

Expanding the IoT Ecosystem

Over 35 companies at Embedded World highlighted the impact of Qualcomm’s technologies in their offerings, spanning robotics, manufacturing, asset and fleet management, and more. This showcases the depth of Qualcomm’s ecosystem and its commitment to accelerating innovation across industries.

Rahul Patel, Group General Manager of Connectivity, Broadband, and Networking (CBN) at Qualcomm Technologies, emphasized the transformative potential of the QCC730 SoC, stating, “QCC730 enables devices to support TCP/IP networking capabilities while remaining form-factor and complete wireless constrained, whilst remaining connected to the Cloud platforms.”

Future-Ready Industrial Solutions

Looking ahead, Qualcomm plans to introduce an industrial-grade platform to cater to the demanding safety and operational requirements of industrial applications. This platform will feature high-performance CPU and GPU capabilities, advanced safe camera ISP with multi-camera support, and necessary industrial I/O needs. Slated for availability in June 2024, this platform aims to bring a new era of intelligence and robust performance to enterprise and industrial environments.

Jeff Torrance, Senior Vice President and General Manager of Industrial and Embedded IoT at Qualcomm Technologies, shared his enthusiasm about the RB3 Gen 2 Platform, “We are excited to introduce the RB3 Gen 2 Platform, which is designed to bring advanced on-device AI capabilities to a wide range of mid-tier IoT applications.”

Qualcomm’s announcements at Embedded World 2024 underscore its dedication to pushing the boundaries of connectivity and AI in the IoT and industrial sectors. With these advancements, Qualcomm not only strengthens its portfolio but also enriches the ecosystem, providing developers and industries with the tools they need to navigate the digital transformation successfully.

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